Die Sort with Smart Binning & Advanced AOI
Mi28W Wafer to Wafer and Mi18 Wafer to Waffle Pack
- ✔ Your solutions to Multi Bin sorting! Every bin counts.
- ✔ Up to 38 bins Sorting for waffle pack output!
- ✔ Both models suited to address your next process and control needs - sort the multi bins to wafer or waffle pack
- ✔ Equipped with 6 Side AOI
Compression Laser Assisted Bonding (ZLAB) & LAB
Ai Series
- ✔ ZLAB is LAB with Added Bond Force Control!
- ✔ Direct integrates into existing FC border line
- ✔ Unparallel performance for warpage sensitive package and narrow pitch device
- ✔ LAB a great option for narrow pitched FCCSP/SIP application!
Fully Integrated Precision Laser Compression Bonder (LCB)
Ai Series
- ✔ Enabling Technology for Large Body Size, Warpage Sensitive, Narrow Pitched packages - Must Have!
- ✔ Better warpage tolerance - up to 400um!
- ✔ Wafer/Waffle Pack Input
- ✔ Integrated Flux Dipping - Die Placement - Laser Bond - All in One!
- ✔ Localized heating with built-in Bonding Force and Height Control
- ✔ Uniform device temperature ensures good bonding!
Strip/Boat based Inspection
Vi20S
- ✔ Infra-red inspection on die back to check for cracks
- ✔ Mi proprietary smart vision MiND.X option available for self-learning capability. Effectively reduce dependency on human eyes for decision - less underkill/overkill!
- ✔ Optical inspection available
- ✔ Ensure process compliance!